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1-Roll 25M Transfer Tape Double Side Thermal Conductive Adhesive Tape for Chip PCB LED Strip Heatsink 12mm Width 0.2mm Thickness\u003c\/h3\u003e\n\u003cp id=\"b\"\u003e\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eType: 1-Roll Double Side Thermal Conductive Adhesive Tape, can glue the heating element and radiator together as a whole, enhancing the cooling effect.\u003c\/li\u003e\n \u003cli\u003eThickness: 0.2mm, Width: 12mm, Length: 25m, very easy for die-cutting and insulation, widely used in LED lighting industry.\u003c\/li\u003e\n \u003cli\u003eAdvantage: High insulation and low hardness, excellent chemical and mechanical stability.\u003c\/li\u003e\n \u003cli\u003eFeature: The thermal double-sided tape can be glued immediately with a light pressure, its adhesion properties and strength increase with time and temperature.\u003c\/li\u003e\n \u003cli\u003eUse: Applied to the bonding of chip, flexible circuit board, high power transistor, radiator and other cooling device. Such as: LED lighting aluminum substrate, CPU Cooler, hard disk, memory chip, south bridge or video memory chip,MOS pipe and so on.\u003c\/li\u003e\n \u003c\/ul\u003e\n\n\n"}

TOTOT 1-Roll 25M Transfer Tape Double Side Thermal Conductive Adhesive Tape for Chip PCB LED Strip Heatsink 12mm Width 0.2mm Thickness 12mm*25M*0.2mm

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TOTOT 1-Roll 25M Transfer Tape Double Side Thermal Conductive Adhesive Tape for Chip PCB LED Strip Heatsink 12mm Width 0.2mm Thickness

Product Features

  • Type: 1-Roll Double Side Thermal Conductive Adhesive Tape, can glue the heating element and radiator together as a whole, enhancing the cooling effect.
  • Thickness: 0.2mm, Width: 12mm, Length: 25m, very easy for die-cutting and insulation, widely used in LED lighting industry.
  • Advantage: High insulation and low hardness, excellent chemical and mechanical stability.
  • Feature: The thermal double-sided tape can be glued immediately with a light pressure, its adhesion properties and strength increase with time and temperature.
  • Use: Applied to the bonding of chip, flexible circuit board, high power transistor, radiator and other cooling device. Such as: LED lighting aluminum substrate, CPU Cooler, hard disk, memory chip, south bridge or video memory chip,MOS pipe and so on.

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