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{"id":12648258633888,"title":"BOJACK Lead Free Solder Flux Tin Paste Sn42 Bi58 Lead Free Solder Paste Low Temperature 138°C Syringe Solder Paste with 2 Dosing Tools and Push Rods for BGA SMT Solder (1.05oz\/35g)","handle":"bojack-lead-free-solder-flux-tin-paste-sn42-bi58-lead-free-solder-paste-low-temperature-138-c-syringe-solder-paste-with-2-dosing-tools-and-push-rods-for-bga-smt-solder-1-05oz-35g","description":"\u003ch3\u003eBOJACK Lead Free Solder Flux Tin Paste Sn42 Bi58 Lead Free Solder Paste Low Temperature 138°C Syringe Solder Paste with 2 Dispensing Tools and Push Rods for BGA SMT Solder (1.05oz\/35g)\u003c\/h3\u003e \u003cp id=\"b\"\u003eBOJACK 1.05oz Low Temperature Syringe soldering paste About products Packaging dimensions: 10cm x 5cm x 1.5cm Product weight (pure weight): 35g Soldering paste composition: Sn: 42%, Bi: 58% Melting point: 138°C (280F) Advantage 1.Lead-free solder paste with good wetting properties, fine-grained, very easy to press and apply. 2.Long adhesive life, long stencil printing life. 3.Good wettability, bright, uniform and full solder joints. Application For suitable for connectors, metal housings, motors, fuses, sensors, wires, electronic components for lighting, SMT repair, implantation of BGA chip balls, etc. Product Contains 1 x Sn42 Bi58 lead-free syringe solder paste 1 x push rods 2 x dispensing tools\u0026lt; \/p\u0026gt; \u003c\/p\u003e\u003ch3\u003eProduct Features\u003c\/h3\u003e \u003cul class=\"a\"\u003e \u003cli\u003eItem sizePackaging dimensions:10cm x 5cm x 1.5cm Solder paste weight (gross weight):35g\u003c\/li\u003e \u003cli\u003eHigh weldabilityThe lot is sold High-performance thixotropic agent, which makes the solder paste highly active, the solder obviously wets during the soldering process, thereby reducing the phenomenon of false solder.\u003c\/li\u003e \u003cli\u003ePractical design characteristics of the piston syringe needle: Reflow does not produce tin beads and tin bridges\u003c\/li\u003e \u003cli\u003e Area of applicationLow temperature Tin is often used for the maintenance of electronic products. Low temperature tin is mainly used for items that cannot withstand high temperature equipment. 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Application For suitable for connectors, metal housings, motors, fuses, sensors, wires, electronic components for lighting, SMT repair, implantation of BGA chip balls, etc. Product Contains 1 x Sn42 Bi58 lead-free syringe solder paste 1 x push rods 2 x dispensing tools\u0026lt; \/p\u0026gt; \u003c\/p\u003e\u003ch3\u003eProduct Features\u003c\/h3\u003e \u003cul class=\"a\"\u003e \u003cli\u003eItem sizePackaging dimensions:10cm x 5cm x 1.5cm Solder paste weight (gross weight):35g\u003c\/li\u003e \u003cli\u003eHigh weldabilityThe lot is sold High-performance thixotropic agent, which makes the solder paste highly active, the solder obviously wets during the soldering process, thereby reducing the phenomenon of false solder.\u003c\/li\u003e \u003cli\u003ePractical design characteristics of the piston syringe needle: Reflow does not produce tin beads and tin bridges\u003c\/li\u003e \u003cli\u003e Area of applicationLow temperature Tin is often used for the maintenance of electronic products. Low temperature tin is mainly used for items that cannot withstand high temperature equipment. For example, electronic components that cannot withstand high temperatures.\u003c\/li\u003e \u003cli\u003eApplicable fieldPaper circuit boards that cannot withstand high temperatures, flexible circuit boards for superstructures, LED light strips, small components, cell phone repair covers\u003c\/li\u003e \u0026lt; \/ul\u0026gt;\u003c\/ul\u003e"}

BOJACK Lead Free Solder Flux Tin Paste Sn42 Bi58 Lead Free Solder Paste Low Temperature 138°C Syringe Solder Paste with 2 Dosing Tools and Push Rods for BGA SMT Solder (1.05oz/35g)

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BOJACK Lead Free Solder Flux Tin Paste Sn42 Bi58 Lead Free Solder Paste Low Temperature 138°C Syringe Solder Paste with 2 Dispensing Tools and Push Rods for BGA SMT Solder (1.05oz/35g)

BOJACK 1.05oz Low Temperature Syringe soldering paste About products Packaging dimensions: 10cm x 5cm x 1.5cm Product weight (pure weight): 35g Soldering paste composition: Sn: 42%, Bi: 58% Melting point: 138°C (280F) Advantage 1.Lead-free solder paste with good wetting properties, fine-grained, very easy to press and apply. 2.Long adhesive life, long stencil printing life. 3.Good wettability, bright, uniform and full solder joints. Application For suitable for connectors, metal housings, motors, fuses, sensors, wires, electronic components for lighting, SMT repair, implantation of BGA chip balls, etc. Product Contains 1 x Sn42 Bi58 lead-free syringe solder paste 1 x push rods 2 x dispensing tools< /p>

Product Features

  • Item sizePackaging dimensions:10cm x 5cm x 1.5cm Solder paste weight (gross weight):35g
  • High weldabilityThe lot is sold High-performance thixotropic agent, which makes the solder paste highly active, the solder obviously wets during the soldering process, thereby reducing the phenomenon of false solder.
  • Practical design characteristics of the piston syringe needle: Reflow does not produce tin beads and tin bridges
  • Area of applicationLow temperature Tin is often used for the maintenance of electronic products. Low temperature tin is mainly used for items that cannot withstand high temperature equipment. For example, electronic components that cannot withstand high temperatures.
  • Applicable fieldPaper circuit boards that cannot withstand high temperatures, flexible circuit boards for superstructures, LED light strips, small components, cell phone repair covers
  • < /ul>