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Heat sinks are used for high-performance semiconductor devices such as power transistors and optoelectronic devices such as light-emitting diodes (LEDs) that do not have sufficient heat dissipation capacity to regulate their temperature. Improving the environment (temperature around the device and air flow) Used to dissipate heat from electronics, chips, ICs, diodes, transistors, MOS, computer components or anywhere small and efficient heat sinks are required. Specification: Product name: Heatsink Material: Aluminum Size: 40 x 40 x 11mm Color: Black Quantity: 4 × Heatsink\u003c\/p\u003e \u003ch3\u003eProduct Features\u003c\/h3\u003e \u003cul class=\"a\"\u003e \u003cli\u003eMaterial: Aluminum; Color: Black; Weight: 24g\/pcs.\u003c\/li\u003e \u003cli\u003eIncludes double-sided thermal adhesive tape, easy to use, strong adhesion.\u003c\/li\u003e \u003cli\u003eThe use of high-quality aluminum, fast heat conduction, good heat dissipation and long service life. Reduce the risk of hardware failure due to overheating.\u003c\/li\u003e \u003cli\u003eThe cooling body maximizes its surface area in contact with the cooling air. It can be used for passive cooling of 3D printers, NEMA 17, TEC1-12706 thermoelectric Peltier coolers, etc. \u003c\/li\u003e \u003cli\u003eUsed for IC, diode, generator, electronic devices, LED, RAM, CHIP computer cooling or all Components used that require efficient cooling.\u003c\/li\u003e\n\u003c\/ul\u003e"}

TAKUZA Pack of 4 heat sinks, aluminum heatsink 40 x 40 x 11 mm, heat sink with adhesive sticker, black cracked slot, heat sink for computer hosts, 3D printers, routers, servers etc.

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TAKUZA 4 pieces heat sink, aluminum heatsink 40 x 40 x 11 mm, heat sink with adhesive sticker, black cracked slot, heat sink for computer hosts, 3D printers, routers, servers etc.

The Radiator is a passive heat exchanger that can transfer the heat generated by electronic or mechanical devices to adjust the temperature of the devices to an optimal level. Heat sinks are used for high-performance semiconductor devices such as power transistors and optoelectronic devices such as light-emitting diodes (LEDs) that do not have sufficient heat dissipation capacity to regulate their temperature. Improving the environment (temperature around the device and air flow) Used to dissipate heat from electronics, chips, ICs, diodes, transistors, MOS, computer components or anywhere small and efficient heat sinks are required. Specification: Product name: Heatsink Material: Aluminum Size: 40 x 40 x 11mm Color: Black Quantity: 4 × Heatsink

Product Features

  • Material: Aluminum; Color: Black; Weight: 24g/pcs.
  • Includes double-sided thermal adhesive tape, easy to use, strong adhesion.
  • The use of high-quality aluminum, fast heat conduction, good heat dissipation and long service life. Reduce the risk of hardware failure due to overheating.
  • The cooling body maximizes its surface area in contact with the cooling air. It can be used for passive cooling of 3D printers, NEMA 17, TEC1-12706 thermoelectric Peltier coolers, etc.
  • Used for IC, diode, generator, electronic devices, LED, RAM, CHIP computer cooling or all Components used that require efficient cooling.